Small Packaging World article on thermal detection and imaging work at the UIUC packaging laboratory. http://www.packworld.com/machinery/inspection/finding-leaks-heat
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New Textbook Announced!
Sections on: Materials and Package Production Food Processing Degradation Reactions Shelf Life and Estimation Techniques Engineering Principles Transportation and Dynamics Inventory Management and Economics Materials Properties Problem Solving Methodology Optimization and Advanced Tools Future Developments Scott A. Morris “Food and Package Engineering” Wiley & Sons. Publisher’s link: ISBN: 978-0-8138-1479-7 Available from Amazon.com